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The main performance of the lead frame
According to the role of the lead frame in the package, the requirements of the lead frame have the following properties:
1. Good conductive properties plays a lead frame chip and the outside connection in the plastic body, thus requiring it to have a good electrical conductivity. In addition, the circuit design, and sometimes even the ground through the chip in the wall to the base of the lead frame, which also requires that it has good conductivity. Some of the higher operating frequency of the integrated circuit, in order to reduce parasitic capacitance and inductance effects of the lead frame conductive performance even higher, the higher the conductivity, the smaller the resulting impedance of the lead frame. In general, copper's conductivity than the conductive material of iron-nickel better.
2. The good thermal conductivity in the use of integrated circuits, always to produce heat, especially in large power circuit, the heat generated is even greater, so when the work requires major structural material of the lead frame can have a good thermal conductivity Otherwise, in working condition due to heat can not be dispersed and "burn" chip. Thermal conductivity can generally be solved two ways, one is to increase the thickness of the lead frame base, the second is a larger selection of thermal conductivity of metal materials do lead frame.
3. good thermal match (IE, thermal expansion) thermal expansion of the material produced in the package, a plastic resin and plastic lead frame body contact, indirect contact and also the chip, thus requiring them to have a good thermal match.
4. Good strength lead frame either in the packaging process, or in the subsequent testing and customer use of the process into the printed circuit board, are required to have good tensile strength.
5. The heat resistance and heat resistance, oxidation resistance measured by the softening temperature. Softening temperature of the material is heated after 5 minutes, the change in its hardness to initial hardness of 80% of the heating temperature. Usually soften at temperatures above 400 ℃ can use. Oxidation resistant material has a great influence on the reliability of the product, due to the heating requirements of the oxide film generated as little as possible.
6. Has some corrosion resistance of the lead frame should not occur stress corrosion cracking, humid climate in general should not be corrosion phenomena arising from a broken leg.
1. Good conductive properties plays a lead frame chip and the outside connection in the plastic body, thus requiring it to have a good electrical conductivity. In addition, the circuit design, and sometimes even the ground through the chip in the wall to the base of the lead frame, which also requires that it has good conductivity. Some of the higher operating frequency of the integrated circuit, in order to reduce parasitic capacitance and inductance effects of the lead frame conductive performance even higher, the higher the conductivity, the smaller the resulting impedance of the lead frame. In general, copper's conductivity than the conductive material of iron-nickel better.
2. The good thermal conductivity in the use of integrated circuits, always to produce heat, especially in large power circuit, the heat generated is even greater, so when the work requires major structural material of the lead frame can have a good thermal conductivity Otherwise, in working condition due to heat can not be dispersed and "burn" chip. Thermal conductivity can generally be solved two ways, one is to increase the thickness of the lead frame base, the second is a larger selection of thermal conductivity of metal materials do lead frame.
3. good thermal match (IE, thermal expansion) thermal expansion of the material produced in the package, a plastic resin and plastic lead frame body contact, indirect contact and also the chip, thus requiring them to have a good thermal match.
4. Good strength lead frame either in the packaging process, or in the subsequent testing and customer use of the process into the printed circuit board, are required to have good tensile strength.
5. The heat resistance and heat resistance, oxidation resistance measured by the softening temperature. Softening temperature of the material is heated after 5 minutes, the change in its hardness to initial hardness of 80% of the heating temperature. Usually soften at temperatures above 400 ℃ can use. Oxidation resistant material has a great influence on the reliability of the product, due to the heating requirements of the oxide film generated as little as possible.
6. Has some corrosion resistance of the lead frame should not occur stress corrosion cracking, humid climate in general should not be corrosion phenomena arising from a broken leg.
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